QUALCOMM HAS MADE a number of announcements at the 3G LTE Summit in Hong Kong, including next-generation Fast Charging Technology with Quick Charge 3.0, two mid-range Snapdragon processors and new connectivity features in the upcoming Snapdragon 820 chip.
It's been a while since we heard any big news from the company, and suddenly three announcements arrive at once. To make it a little easier to digest, we've split them into sections from most to least interesting and significant.
Faster charging for Android
Quick Charge 3.0 is the third generation of Qualcomm's speedy device charging technology and is also, apparently, "the first of its kind" to employ Intelligent Negotiation for Optimum Voltage.
This is a new Qualcomm algorithm that allows portable devices to determine the power level to request at any point for optimum power transfer. Qualcomm said that this is about 38 percent more efficient than Quick Charge 2.0.
Qualcomm claimed that a typical phone can be charged from zero to 80 percent in about 35 minutes with Quick Charge 3.0, compared with almost 90 minutes without the technology.
Quick Charge 3.0 is available from today, and is an option on selected Snapdragon processors, including the 820, 620, 618, 617 and 430, and is anticipated to appear in mobile devices next year, Qualcomm said.
Qualcomm has integrated a newly upgraded X12 LTE modem into its upcoming Snapdragon 820 processor, which we are still yet to see in its entirety.
This will provide 4G LTE and WiFi technologies for premium tier mobile devices, Qualcomm said, alongside addressing "unprecedented demand for blazing fast connectivity and seamless services".
The Snapdragon 820's upgraded X12 LTE modem brings the following features: Cat 12 (up to 600Mbps) in the downlink; Cat 13 (up to 150Mbps) in the uplink; up to 4x4 Multi-Input Multi-Output (MIMO) on one downlink LTE carrier; multi-gigabit 802.11ad; LTE-U and LTE+WiFi Link Aggregation; and next-gen HD Voice and Video calling over LTE and WiFi.
Qualcomm said that this makes the 820 the first publicly announced processor for use in mobile devices to support LTE Category 12 in the downlink and Category 13 in the uplink, providing up to 33 percent and 200 percent improvement over its predecessor's download and upload speeds respectively.
"Also available as a discrete chipset, the X12 LTE modem has demonstrated peak download speeds of up to 600Mbps through 3x downlink carrier aggregation and 256-QAM, as well as peak upload speeds of up to 150Mbps through 2x uplink carrier aggregation and 64-QAM," explained the firm.
"The Snapdragon 820 is also the first publicly announced processor to offer LTE support for 4x4 MIMO designed to double download throughput speeds on a single LTE carrier."
Qualcomm unveiled two new mid-range chips, the Snapdragon 430 and 617, which it said will offer advances in multimedia and connectivity for mid-price mobile devices.
The Snapdragon 430 features X6 LTE, with Cat 4 downlink speeds of up to 150Mbps and support of 2x10MHz Carrier Aggregation, and Cat 5 uplink speed of up to 75Mbps via support for 64-QAM - a first in this tier, the firm claimed.
Incorporating features previously limited to the high tier, the Snapdragon 617 improves on the connectivity and capabilities of the Snapdragon 430.
"To meet the global demand for faster LTE data rates, the Snapdragon 617 integrates the X8 LTE modem, featuring support for Cat 7 download speeds of up to 300Mbps and upload speeds of up to 100Mbps using bi-directional 2x20MHz carrier aggregation," the firm said.
The 617 also shares the same software advances, dual-ISP and camera architecture of the Snapdragon 620 and 618.
The Snapdragon 617 and 430 both use ARM Cortex A53 CPUs in octa-core configurations, and include support for Quick Charge 3.0. Each also uses the high performance, low power Qualcomm Hexagon DSP, supporting low power sensors and advanced audio. µ
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