SPECIFICATIONS HAVE LEAKED for Qualcomm's upcoming Snapdragon 820 mobile processor, ahead of its rumoured launch on 11 August.
The chip was expected to be officially unveiled later this month, but an analyst called Pan Jiutang has let the cat out of the bag, posting some slides on Weibo on Wednesday that revealed some pretty detailed specifications.
Qualcomm has refused to comment on the leak. "Unfortunately I don't have anything for you at the moment as Qualcomm does not comment on rumours," said a company representative.
And while the slide might not be 100 percent legit, it is in line with many other rumours circulating at the moment, and most likely accurate.
It shows that the Snapdragon 820 sports the newer Hydra CPU which is claimed to be 35 percent faster than Qualcomm's current 810 processor.
There's also an Adreno 530 graphics processor which is said to be 40 percent faster than the firm's latest high-end chip, while also being 30 percent more power efficient.
This better use of power is a result of the chip's new 14nm manufacturing process, which is much smaller than the 20nm Snapdragon 810.
The slide also suggests that the Snapdragon 820 could be available by the end of the year, and that manufacturers will bring devices to market by the first quarter next year. It is also rumoured that the Samsung Galaxy S7 will be powered by the 820 with a release sometime in the second quarter.
However, something the slide doesn't touch on is the real question on everyone's lips: will the damn thing have overheating problems like the Snapdragon 810?
We won't know until we can get to try it, but let's hope that Qualcomm has sorted out any problems before manufacturers bring 820-powered phones to market.
The octa-core Snapdragon 810 was announced at the end of last year. Rumours about overheating circulated when several leading smartphone manufacturers ditched the chip in favour of other offerings.
For instance, Samsung decided to equip the Galaxy S6 with its own octa-core chip rather than Qualcomm's 810. Then LG announced in April that the G4 smartphone would use the less powerful hexa-core Snapdragon 808.
This fuelled further speculation that the 810 chip had problems. Qualcomm denied the claims, saying that LG's decision to stuff the G4 with a Snapdragon 808 was made "over a year ago" and had nothing to do with the persistent rumours surrounding the 810.
Later in April, it was reported that Qualcomm would ditch Taiwanese Semiconductor Manufacturing Company in favour of Samsung to manufacture the next-generation Snapdragon 820 mobile processors, so it could be that the two chip firms have worked together to overcome any heating problems. We'll just have to wait and see. µ
The gadget fiddlers at iFixit have stuck it to Redmond's new fondle slate hybrid
Intel could get rudely pushed aside in favour of custom ARM CPUs
Sky Mobile becomes first UK operator to show its hand
Sweeping layoffs come as firm shelves plans for an Essential Phone 2