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MEMORY MAKER Samsung has announced that its 3GB LPDDR3 modules intended for use in smartphones are in mass production.
Samsung has been a market leader in the DRAM industry for years and the firm has adapted well to producing DRAM chips intended for mobile devices. The company announced that it has put 3GB LPDDR3 chips into mass production, ahead of rivals Hynix and Elpida.
Samsung said its 3GB LPDDR3 modules are fabbed on a 20nm class process node and that they consist of two sets of three stacked chips in a single package. The firm said that the package is 0.8mm high, which is particularly important given that the firm is pitching the modules to smartphone makers that are increasingly wanting thinner chips to save space for other components.
Samsung claimed the chips offer maximum bandwidth of 2.1Gbps and touted high-end mobile use cases. The firm said that growth in high quality video and high bandwidth LTE networks drives the need for more RAM in smartphones.
Samsung memory sales and marketing EVP Young-Hyun Jun said, "Three gigabyte mobile DRAM will be adopted in the most up-to-date, high-end smartphones starting in the second half of this year - an initial adoption that will expand to most high-end smartphones worldwide next year.
"We will develop a new 3GB LPDDR3 solution based on four 6Gb LPDDR3 DRAM chips by symmetrically stacking two chips on each side, which will boost smartphone performance to the next level by year-end."
While Samsung's 3GB LPDDR3 module is too late for the firm's flagship Samsung Galaxy S4 handset, it won't be surprising to see the Galaxy Note 3 with 3GB of RAM. Given that the firm is almost certainly not going to put a 64-bit ARM chip into the Galaxy Note, 3GB or RAM will be a natural choice for a 32-bit processor and will take the space of only a single DRAM chip. µ