MEMORY MAKER Hynix announced 8Gb LPDDR3 modules based on a 20nm class process node for smartphones and tablets.
Hynix, the main rival of Samsung and Nvidia's memory maker of choice for a number of years, has been working on low-power DRAM technologies for the mobile market. Now the firm has announced its first 8Gb LPDDR3 modules that can be stacked to produce 4GB in a single package.
Hynix said its 8Gb LPDDR3 modules run at 2,133MHz and work at 1.2V. The firm claimed that power consumption is 10 percent lower than LPDDR2 modules and touted the modules as being suited to smartphones, tablets and even ultrabooks.
Richard Chin, SVP of global sales and marketing said, "With the development of this high density LPDDR3 using 20nm class, Hynix is now able to supply a top-performance product suitable for mobile devices to the market. Especially, this development has its significance since the Company has secured top-level competitiveness in mobile products by developing it simultaneously with PC DRAM using the same 20nm class process technology."
Hynix has previously told The INQUIRER that it is working on stacking DRAM modules in a package for Nvidia's upcoming Volta GPU and by working on low power DDR technologies the firm can cater to both mobile devices and semiconductor vendors that want to put DRAM in the same package as the CPU or GPU.
Hynix will offer its 8Gb LPDDR3 modules in package-on-package or embedded multimedia card format. The firm said customers are already sampling the 8Gb LPDDR3 chips, with mass production slated to start by the end of the year. µ