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Infineon and Globalfoundries collaborate on 40nm embedded flash process node

To produce the next generation of microcontrollers
Mon Apr 29 2013, 14:07

CHIP VENDOR Infineon has signed a deal with wafer fab Globalfoundries to develop and produce embedded flash microcontrollers on a 40nm process node.

Infineon, one of Europe's largest semiconductor vendors, has been working on embedded flash for some time and now it has entered a deal with a chip foundry to turn its research into products. The firm has signed an agreement with Globalfoundries to co-develop its embedded flash microcontrollers on a 40nm process node.

According to Infineon, manufacture of its next generation embedded flash microcontrollers initially will proceed at one of Globalfoundries' fabs in Singapore, eventually moving to the firm's Dresden fab. While Globalfoundries has been churning out 40nm chips for CPUs and system on chip (SoC) modules for many years, the 40nm process node is leading edge for flash microcontrollers.

Infineon said the microcontrollers produced by the Globalfoundries will find their way into security and automotive applications. Globalfoundries CEO Ajit Manocha said the firm is "looking forward to a long-term collaboration with Infineon".

Arunjai Mittal, a board member at Infineon Technologies said, "Next generation embedded flash microcontrollers with 40nm process structures will further enhance our competitive strength in the automotive as well as chip card and security markets.

"We trust in Globalfoundries with their excellent manufacturing background and sites on different continents to fulfill Infineon's stringent quality, infrastructure security and business continuity requirements."

Globalfoundries said process and product qualification of embedded flash microcontrollers used in the security industry will begin in the second half of 2015, while parts for the automotive industry are scheduled for the first half of 2017. µ


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