CHIP DESIGNER Broadcom has announced it has started sampling its 28nm 4G baseband modem chip for smartphones and tablets.
Broadcom, which does a steady trade in wireless modem and baseband chips, has been accelerating development of its 4G chips as deployment of 4G increases. Now the firm has announced that it is sampling the BCM21892 4G integrated baseband modem chip that is fabbed on a 28nm process node.
According to Broadcom the chip, which supports 4G LTE Advanced, HSPA+, TD-SCDMA and EDGE/GSM protocols, offers bandwidths of up to 150Mbit/s. The firm claimed that due to the use of a 28nm process node the BCM21892 chip takes up 35 percent less space than previous designs, something that device makers are increasingly becoming concerned about given the physical limitations placed on circuit board designs.
Robert Rango, EVP and GM of Broadcom's Mobile and Wireless Group said, "Broadcom's new 4G LTE modem combined with our WiFi, Bluetooth, GPS and NFC technologies gives OEMs all the communications technologies needed to build advanced devices that will offer consumers the features, speed and functionality they demand in their next smartphone purchase."
Broadcom said it is now sampling the BCM21892 and expects to put it into mass production in 2014, adding that it will show off its 4G chips later this month at Mobile World Congress. µ
Uses 20 percent less power than traditional systems
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