CHIPMAKER Toshiba announced it has started sampling 64GB NAND flash chips with the controller in the chip package.
Toshiba supplies NAND flash chips to many smartphone and tablet makers including Apple, and like its rival chipmakers it has been working not only on increasing capacity but on reducing the circuit board footprints of its chips. Now the firm said it has been sampling 64GB NAND chips since January that incorporate the controller in the same package.
Toshiba said the 64GB NAND flash chip that comes in FBGA packaging supports the JEDEC UFS I/F standard and is designed for use in smartphones and tablets. However the firm's most useful innovation is the fact that it has implemented the memory controller onto the chip, meaning circuit board space is spared and customers need only buy a single chip.
As Toshiba's chips use the UFS standard that make use of 'lanes', the chip with its single upstream and downstream lane has 2.9Gbit/sec bandwidth. The firm said the chip's packaging measures 12x16x1.2mm with the FBGA packaging using 169 balls and said the sampling is mainly for OEMs and operating system vendors to test the UFS protocol rather than the chips themselves.
Toshiba said the market is demanding larger capacity NAND chips that have increased bandwidth but added that it will only schedule mass production of its 64GB UFS NAND chips if it sees market demand, suggesting that manufacturing firms might not immediately be sold on the UFS standard. µ