MEMORY MAKER Samsung has announced production of embedded Multimedia Card (eMMC) chips in 16GB, 32GB and 64GB densities.
Samsung has been pushing the performance and capacity of its eMMC NAND flash chips to meet the demands of high-end smartphones and tablets. Now the firm said it has begun volume production of eMMC Pro Class 1500 modules in 16GB, 32GB and 64GB capacities.
According to Samsung its latest memory chips, which use a toggle DDR2 interface, have a sequential read bandwidth of up to 140MB/s while write bandwidth is up to 50MB/s. As for random I/O, Samsung claims the chips can do 3,500 IOPS read and 1,500 IOPS write.
Samsung also touted its ability to create high memory densities afforded by its 20nm class process node. The firm said the eMMC chips can be stacked in two, four or eight dies with the largest 64GB capacity having a thickness of 1.2mm.
Given Samsung's leading position in the NAND flash memory market, this announcement suggests that high-end smartphones and tablets will stick to a maximum of 64GB on-board storage for a year or two yet. Of course handset makers can opt to put more than one of Samsung's chips on the PCB, but given the space constraints of smartphones and tablets and the need for larger batteries, that seems unlikely.
Samsung said it expects its eMMC Pro Class 1500 NAND flash memory chips to end up in high-end smartphones and tablets. µ
Sign up for INQbot – a weekly roundup of the best from the INQ