CHIP MAKER Samsung started production of its embedded multi-chip packaging (EMCP) bringing low-power DDR2 modules to entry level smartphones.
Samsung's EMCP can use 30nm and 20nm DRAM modules, with the firm targeting entry level and mid-range smartphones and tablets. Samsung is the world's largest DRAM manufacturer, with its modules ending up in both its own smartphones and those of others.
Samsung will package modules into a 4GB embedded multimedia card that is based on 20nm-class NAND memory for data storage. That will be supported by either 256MB, 512MB or 768MB of 30nm-class low-power DDR2 DRAM with bandwidth of 1,066Mbit/s.
Myungho Kim, VP of memory marketing and device solutions at Samsung Electronics said the firm will expand on its initial EMCP offering. Kim said, "Samsung will further accelerate growth in the mobile device market as it extends the advanced memory segment by providing a more expansive line-up of EMCP solutions in 2012."
Samsung claimed its 30nm-class DRAM chips use 25 per cent less power than its 40nm-class modules. More importantly for the company, the 30nm-class modules improved chip manufacturing productivity by 60 per cent over 40nm modules.
The market for entry-level smartphones is growing with manufacturers like ZTE reaping profits selling cut-price handsets. Samsung's latest memory modules highlight the need for handset makers to have price-binned parts in order to set aggressive prices. µ