MWC: Qualcomm announces 28nm mobile broadband chipsets

WIRELESS CHIP firm Qualcomm has announced two 28 nanometer LTE/DC-HSPA+ mobile broadband chipsets, the MDM9615 and MDM8215.

The MDM9615 has multi-mode and multi-band support, including LTE, DC-HSPA+, EV-DO Rev-B and TD-SCDMA, while the MDM8215 supports only DC-HSPA+. Both are aimed at the 3G and 4G markets.

They are designed for the WTR1605 radio frequency integrated circuit and PM8018 power management integrated circuit designs. They will provide optimised power consumption, a low carbon footprint and GPS support via the GLONASS satellites.

They feature Qualcomm's interference cancellation and equalisation algorithm, which allows greater network capacity, and are compatible with Qualcomm's power optimised envelope tracking product, which provides power and heat management enhancements. They will also come with a dedicated processor.

The chipsets are the successors to the MDM9600 and MDM8220 lineup and feature a number of advancements over previous models, including improvements to the board area, higher performance, lower power consumption and lower material costs.

The chips are not expected to go into production until later this year. µ