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Apple wants to stack circuits on its chips
A RECENT PATENT FILING indicates that Apple wants to put a whole computer on a chip.
Not content with current system on chip (SoC) designs that merely put a CPU, GPU and some communications logic into one package, Apple filed a patent application to stack a chip with memory, accelerometers and a load of other brick-a-brack. The idea is to shrink everything down, making it not only more power efficient but also reduce the physical footprint and, in theory, lower manufacturing costs.
The move marks the latest chapter for the firm as it tries to get into the chip design game. The A4 chip that powers the Ipad and Iphone 4 has been successful for the cappuccino company, although the British outfit ARM designed the core. This patent is unlikely to change ARM's dealings with Apple, however, as its main concern is with the packaging of various other components into one package along with the CPU core.
The patent filing could be a rare case of Apple actually showing that it can think up truly innovative technologies. The notion of chip 'stacking' is not particularly new, with ARM having promoted it in the past as a way to achieve multi-core chips. However the idea of using stacks for other components could result in Apple fitting a hybrid chip based on the A4 into more devices.
While the patent certainly makes for interesting reading and crystal ball gazing, it is not known whether the so-called "system on a substrate" technique would be economically viable at this point. Another problem for Apple is that in this domain it is up against semiconductor powerhouse Samsung, which not only makes the chips for Ipads and Iphones but also has a wealth of experience in getting clever semiconductor designs to market.
Still, it goes to show that Apple does indeed have a few engineers who are capable of coming up with good technological solutions. All that's left is for the firm's CEO, device designers and marketing departments to cripple it with a stylish but duff antenna. µ
Tags: Apple
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Doesn't a memory chip company own this patent? If this gets approved I'm sure there are some bad ethics or fraud involved with the USPTO as most of Apple patents are rip off of other patents...
With this kind of a design would there no be problems with heat dissipation. Especially in the type of devices that Apple primary deals with i.e. iPod, iPhone, & iPad. They have limited room for cooling devices and already produce a fair amount of hear. Just a fair question.
Kataan
the article writer should understand that 99.99% of patents are quite fictional either in content or in terms of a valid claim
even being granted a patent doesn't mean much, its merely the right to contest in court
this patent is simply a "greenmail" attempt by apple to stifle competition
combinations of manufacturing technology are always in the public domain and no doubt the only result will be some well fed lawyers and a further trashing of the reputation of the patent system
This sounds like the dildo that tried to copyright the term Y2K
Maybe their resources would be better off trying to make farts smell less offending
if this patent gets approved , then someone at the patent office is clearly on the payroll.
WIRES? You want to patent WIRES and PC BOARDS? Is that the level of Apple engineering?
Yes, I read the application. Nothing that isn't TRIVIAL, OBVIOUS, been done a gazillion times. For example, Polaroid pioneered flexible circuits incorporating various disparate items back in the 80's. This wouldn't stand up a second in court.
Sorry, but a flexible pcb isn't new. The idea of the patent is to put multiple parts on 1 chip, then wire them together with a flexible pcb. It is also a just a faster solution to integration of parts. Most companies would wire everything together on the chip, they want to put all the major components together and wire it externally.
If you had bothered to read the patent, which you clearly didn't, you would have read that it is for a novel flexible printed circuit interconnect.
The patent isn't for stacking.
this is not a new or original idea. Unless they can show some novel interconnect and patent just that part, this is not something that should be approved. I mean, things have been moving in this direction already and chip stacking is something they did in the early 90s with co-processors.