EXTREME ULTRAVIOLET LITHOGRAPHY (EUV) will take processors down to 13nm scale, according to Global Foundries, with production starting later this decade.
The company will install the first EUV units in its New York Malta plant in 2012 and will aim for volume production by 2014 or 2015 without the usual pre-production testing.
Speaking at SEMICON West 2010 Gregg Bartlett, Global Foundries' SVP of process technology and research and development, predicted that size will be the next battleground in chip rollouts.
Bartlett said advances in materials, package integration and lithography are key for future silicon design. The technological challenges facing the industry are severe, he said, and require a collaborative approach to research, development and production. The billions needed to develop next-generation chip architectures can only come from concentrations of knowledge and resources.
In the meantime he foresees 28nm scale microprocessors using high k metal gate technology delivering density increases of 100 per cent with a 50 per cent cut in energy use and the same increase in speed. µ
New Song:Walkin' da Cores....About 5 nm hard stuff turns soft. Gamma Ray is .1nm or Smaller. Really Straight line IS Scintalated Beams, Blocking ALL Radi except Say 2 nm of width, from Highly charged Anode.
Used More In Nu Coke, Kind with Real Coke In IT, than , Circuits Are Ground with Coke Spoon Jewelry Item. Rinse Is With Real Coke,too.
Its' ALL Voltage Thru Time.
vondrashek
back in the day we only had people, we would line them up by the thousands on a grid drawn in the dirt. When the person on the left of you hit you, you hit the guy in front of you, if the person on the left and right hit you, you hit the guy behind you.
But it just ended up in a big fight and we never got the calculations done.
Then there were the Domino processors, but resetting them after each entry was such a pain,,,,, almost as much pain as the pop up adds on the inq
Who you trying to kid?
They didn't have 2 liter Coke bottles then, only hollowed out logs...
bigger_luddite:
You were lucky! We dreamed of having sharpies and rubber stamps! In my day we would pour magma into one foot square cast iron molds. After polishing the surface, a crew of engravers and fine stone carvers would do the fine detail work of inlaying the tiny chips of germanium, mica, galena, etc. as well as chiseling all of the tiny interconnect channels. Later jewelers would come in and pour molten copper into the interconnect channels and attach small gold wires for any remaining point to point connections. We could whip one of these out about every other month!
They don't have mask defect inspection until 2015. They're gonna be delayed by tons of defects they find. Panic because no preproduction practice. Lose a generation, then out of the game.
In my day, we used Sharpies to draw prototype masks of modular sections, then when the design was proven, got the office supply company down the street to make rubber stamps. To use the modules we played a sort of "bingo", with team leader calling out grid coordinates and a stamp code, several of us stamping out the same design. Of course, in those days, we didn't have the modern "refined" silicon, we just used fine white beach sand, sifted to remove impurities, held in an epoxy binder, molded in empty 2-liter Coke bottles, and cut off with a hacksaw. ... Yep, them were the days. You young 'uns would do well to learn what *real* engineering is, takes a lot of sheer persiflage.