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The Common Platform announces a 32nm and 28nm design platform
THE FIVE-HEADED DESIGN MONSTER that is IBM, Globalfoundaries, ARM, Synopsys and Samsung has issued a technology enablement plan for the design and manufacturing of advanced mobile and embedded devices.
Basically the design is for an optimized high performance, low-power processor along with physical fabrication IP from ARM. It also includes tools, connectivity IP and integrated design flow from Synopsys and 32nm/28nm low-power process technology from the Common Platform alliance of IBM, Samsung and Globalfoundaries.
The Common Platform is based around a 32nm and 28nm process using an innovative high-k metal gate method to fix the limitations of polysilicon technology.
The 32nm technology is scalable to 28nm for area optimization. It will mean that fabs can move to 28nm technology without the need for a major redesign.
This will mean that there will be a lower risk, reduced cost and faster time-to-market for anyone trying to use the technology. µ
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Amount of Power Used in mobi Is Low Already, Yet To Move From 40 nm High K has Been Slow Confused Mess. Low K Allows Less Power to Push Thru Tranistors Fire Initiation. Fire King With Wee Little Match, NOT Flame gun.
So Why NOT try 40 Nm at Low K? Already In Process Developement, ?While just small Change in ?tranistor size may be negliable, excepting Much Moore advanced engineering of Circuit itself.Until 28 nm Circuit Is Final, Well, 28nm High K Is First Step.
High K Is Good For Intial tranistion, yet NOT Sure what that extra Transistion IS. Stepping Down Scale Just to Step Isn't Much, equipment to manufacture imoproves, theory improves, yet actual part might gobble More Power than Low K from well established tier, 40 nm.
Lots' More.
drashek
How about a 32nm i7 930 from the guys that call themselves Intel
Silicon Pimps!