TSMC orders an EUV lithography system from ASML

SEMICONDUCTOR FAB EQUIPMENT MAKER ASML Holding announced today that Taiwan Semiconductor Manufacturing Company (TSMC) will be receiving a cutting-edge lithography system.

The Twinscan NXE:3100 extreme ultraviolet (EUV) lithography system will be one of six EUV lithography deployments for ASML and TSMC will be the first dedicated foundry conducting onsite EUV development. According to ASML, the deal highlights TSMC's continuing investment in the European semiconductor market. The new system is expected to be installed on its Fab 12 Gigafab for development of future technology nodes.

Dr Shang-yi Chiang, TSMC senior vice president of research and development said, "TSMC will use a Twinscan NXE:3100 for research and development of future advanced technology nodes. EUV is one of [the] next-generation lithography technologies we are investigating. Working with this system is in line with our objective of maintaining advanced technology leadership. At the same time, this agreement reinforces our historic commitment to investing in the innovative European semiconductor community which, through ASML and others, will play a pivotal role in our process technology development in the future." µ