TAIWANESE MANUFACTURER Winbond has announced it will begin 40nm development in 2010, but the outfit is refusing to say if it will team up with Elpida to get the chips out.
Digitimes said that company president Chan Tung-Yi has budgeted a 50 per cent increase in capital expenditure and this includes expenses for 40nm development.
Apparently the cunning plan is to increase capacity at its 12-inch fab to 34,000 wafers per month from the current 32,000. It will also expand monthly capacity for NOR flash products from 4,000 to 6,000 wafers.
However this has left open the question of whether Winbond can enter this particular market by itself without help. Some have suggested that it will team up with Elpida, something that both sides are keeping mum about.
The increased expenditure announcement is a little risky. Last week Winbond said it suffered big losses in 2009 for the third year in a row. µ