You have to pay eternal attention to developments that could become a 10X factor in your business - Andy Grove - Only the Paranoid Survive
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AMD introduces ATI Radeon E4690
AMD TOOK ADVANTAGE of the Digitimes Tech Forum to show off its ATI Radeon E4690 Mobile PCI Express module (MXM) for graphics intensive systems.
Today the firm said that the GPU module met the current MXM 3.0 industry standard for reduced power and improved cooling, explaining that it will contribute to the design and manufacture of much more efficient, speedier systems.
"As the graphics requirements for embedded systems continue to increase, AMD has armed the ATI Radeon E4690 MXM with features that are important to our customers and done so within an industry-standard specification that helps simplify design, development and market delivery," said Richard Jaenick of AMD. "Based on the successful ATI Radeon E4690 GPU, the ready-made ATI Radeon E4690 MXM solution provides the graphics performance, energy efficiency and reliability customers need."
AMD said that the system offers triple the graphics performance of comparable systems, such as the ATI Radeon E2400 to E4600, and is ideally suited for use in digital signage, image recognition, surveillance, arcade and casino games, and medical imaging.
Features include support for both Microsoft DirectX 10.1 and AMD's Unified Video Decoder 2 (UVD 2) as well as 512MB of on-board GDDR3 memory, 320 shader processors, and adjustable system clocks. µ
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play BBC HD without descending to a pile of pixelated mush every 30 seconds...
No that is on package. Being on die would be on the same silicion microchip wafer physically next to the core. The memory controller for example is on die. This would not happen anyway as the chips have different process nodes and are made at different factories then assembled on the package elsewhere.
Say you have an Intel Core i7 for example, the memory controller is on die here. On the Core i3 the memory controller is on package because it is with the gpu in a separate chip under the heatspreader not with the CPU core.
Perhaps an image? Fudzilla ran this same story a few days ago with a photo.
Here's the link:
http://www.fudzilla.com/content/view/17371/34/
Sooooo... back to the question.
PJ,,, where do you get 'on-die' from? The article says 'on-board'. This is nothing new.
I can't help but notice that the name ends in the digits "4690", so I wonder if this is more powerful than the 4670's currently offered in laptops?
Since it's MXM, I wonder if it is compatible with most notebooks. The one thing that I did notice (I haven't seen this on laptop MXM cards that I've seen) is the memory chips on the same package as the GPU die.
Any thoughts?