The Inquirer-Home

Via shrinks boards even further

Mobile-ITX unveiled
Tue Dec 01 2009, 17:30

VIA TECHNOLOGIES has taken the wraps off its smallest PC board form factor yet, the Mobile-ITX, which is 50 per cent smaller than its predecessor the Pico-ITX.

Running with the growing trend toward mobile devices, Via developed the Mobile-ITX open form factor specification for ultra-compact and portable embedded devices.

via-mobile-itx

The 6cm x 6cm computer-on-module specification bundles in a core CPU, chipset and memory functionality and I/O that includes the CRT, DVP and TTL display support, HD Audio, IDE and USB 2.0, as well as PCI Express, SMBus, GPIO, LPC, SDIO and PS2 signals, through customisable baseboards.

According to Via, Mobile-ITX-based systems consume as little as five Watts and are a modularised design split between a CPU module card and an I/O carrier board.

"With Mobile-ITX we have again pushed back the barriers that limit just how small an embedded industrial PC can be," said Daniel Wu, vice president of the Embedded Platform Division at Via.

"Mobile-ITX enables the creation of a new breed of ultra-compact, portable networked devices suitable for a range of applications, particularly in modern medical and military segments."

Full details can be found in Via's 'Mobile-ITX Form Factor' (PDF) white paper. The company expects to start shipping the Mobile-ITX modules commercially, early next year. µ

 

Share this:

blog comments powered by Disqus
Advertisement
Subscribe to INQ newsletters

Sign up for INQbot – a weekly roundup of the best from the INQ

Advertisement
INQ Poll

Dead electronic devices to be banned on US-bound flights

Will the new rules banning uncharged devices be effective?