JAPANESE ELECTRONICS GIANT SONY today released the first batch of chips featuring a new data exchange technology called Transfer Jet.
The chips, which are hypothetically capable of transferring data at speeds of up to 520Mbps, will actually have a real word transfer speed closer to 375Mbps once error correction and other environmental factors are taken into consideration.
But there's no need to worry that all of your Bluetooth devices will soon be finding their eway into the nearest bin, as Transfer Jet has been designed to fill a competely different niche in the increasingly crowded gadget market.
The chips, which are small enough to be crammed into even the tiniest of memory cards opening up a massive raft of applications, have a tiny amount of radio frequency output as they are designed to be used in very close proximity to the device receiving the data transfer. In fact, the power has been ramped down so far that the maximum transmission distance is about three centimetres.
Sony and the fellow members of the Transfer Jet consortium - which was set up in July 2008 and includes such big punchers as Canon, Toshiba, Casio, Kodak, Panasonic and Pioneer among a veritable Who's Who of electronic superpowers - are jointly hoping that the new tech will become an industry standard for moving reletivley small amounts of data between devices.
Hold your digital camera close enough to your printer and your photos will be automagically ripped and printed. Touch your smartphone against a friend's and files can be shot back and forth instantly. Hold your PDA against an information point in a shopping centre and you'll have all the maps, data and no doubt annoying advertising you could ever need.
Two new LSI chips, the imaginatively named CXD3267AGG and CXD3268AGW are available along with a reference kit and a software developement kit from today, and you can expect to see TJ-enabled devices tipping up in the first quarter of next year, if not sooner.
Sony is also releasing three prebuilt modules incorprating the new chips. A compact module for use in mobile devices like phones and gaming handhelds, a PCI Express mini card module for notebooks and a USB connection module will all make integration simpler for non consortium OEMs to use the technology. Sample prices for both LSI chips are set at 1,500 yen (£10). µ
Pre-orders to begin on 9 September with release to follow on 16 September
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