TSMC to increase 300mm wafer production

CHIP FOUNDRY Taiwan Semiconductor Manufacturing Company (TSMC) will increase production of its 300mm wafers on 45/40nm processes in the next few months.

According to DigiTimes, the independent semiconductor fab plans to step up production by a third even as overall wafer shipments in the fourth quarter are forecast to drop three per cent.

TSMC wants to output on average 40,000 wafers on 45/40nm per month in the next four months, which is an increase from 30,000 units in the third quarter.

Apparently the foundry is running flat out producing the wafers and its production lines are at 100 percent capacity. TSMC managed to run at only 93 per cent capacity for the third quarter.

OEMS are apparently a little concerned that they might have too much product in their inventories and are expected to cut back on wafer orders by three percent in the next few months.

However TSMC's latest production plan is good news as it indicates that the long term future of the industry is still looking good. µ