USB 3.0 group seeks help

CHIPZILLA apparently drew the short straw at the last meeting of the USB 3.0 Promoter Group, as it got the task of advertising that the industry consortium is looking for additional contributors to help finish up the USB 3.0 specification in the first half of next year.

Intel writes, "SuperSpeed USB will create a backward-compatible standard with the same ease-of-use and plug-and-play capabilities of previous USB computer connection technologies, ports and cabling. The personal USB interconnect is targeting to deliver over 10 times the speed of today's connection and will be optimized for lower power and improved protocol efficiency."

The USB 3.0 Promoter Group includes HP, Intel, Microsoft, NEC, NXP Semiconductors and Texas Instruments. Its next meeting to review the draft USB 3.0 specification is set for January 14-15, 2008 in the gem of the west, Las Vegas.

If you're a company that's already a USB Implementors Forum member in good standing and want to get aboard to assist finalising the USB 3.0 specification, the place to go to sign a USB 3.0 contributor agreement and get cracking is here. µ