Intel is stacked

It is hard to see with the naked eye, and damn near impossible to make out in a blurry photo, but the above pic is a CPU package bonded to a flash package. The point being to lessen the footprint for size critical apps like cell phones. This is not the same as die stacking, conceptually similar but package stacking is a much easier problem.

That brings us to the upcoming 50nm flash process from Intel and Micron. This will be out in 2H/07, most likely in Q3. Not much more to say than the obvious, but it is nice to know it is on the way.µ