Those include information on the European lead ban, tin whiskers, memories, DDR III, M-RAM, F-RAM and 3D memories, opto packaging and MEMS (micro electromechanical systems).
Other topics it's interested in include wafer level reliability, flip chip technology, discrete power devices, and the 802.11x (wireless) standards.
The organisation said that the deadline for submitting abstracts is November 22nd, and the presentation papers have to be non-commercial, focusing on the technology rather than a company's products.
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