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JEDEC calls for "tin whiskers" experts

Call for papers for chip conference
Tue Nov 12 2002, 16:31
JEDEC, THE body supervising memory standards, will hold a technical conference in March at the Silicon Valley conference centre, and has asked for presenters and papers on a number of up coming technologies.

Those include information on the European lead ban, tin whiskers, memories, DDR III, M-RAM, F-RAM and 3D memories, opto packaging and MEMS (micro electromechanical systems).

Other topics it's interested in include wafer level reliability, flip chip technology, discrete power devices, and the 802.11x (wireless) standards.

The organisation said that the deadline for submitting abstracts is November 22nd, and the presentation papers have to be non-commercial, focusing on the technology rather than a company's products.

 

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