Microsoft contracts TSMC to make Xbox 360 chips

The contract will make TSMC the largest supplier of the 90-nm process service next quarter, with an expected volume of 6,000 300-mm wafers a month, taking up almost 10% of TSMC's entire 300-mm wafer fab capacity. Contrary to its name, it is neither an aperitif nor is it fabulous.

TSMC has not yet made any comment on all of the attention but has apparently projected to boost wafers processed with the 90-nm process to make up over 10 per cent of its entire shipments next quarter, says the Taiwan Economic News. µ

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