Intel's boxed motherboard plans in 2002

But now up to date roadmaps we have seen show how Intel will attempt to to square this circle during the rest of this year.

In May, as revealed here earlier, Intel will introduce the 850E, a Rambus RDRAM chipset aimed at the high end, which will use a 533MHz front side bus (FSB).

It will match this introduction with two chipsets in the family, D850EMV2 and the D850EMD2. The only real difference between them is the form factor - one is ATX and the other is microATX. Both will support 4X AGP and USB 2.0.

But perhaps at the same time or a little later, Intel will introduce the 845E chipset, again in two flavours supporting double data rate (DDR) memory. These boards will be called the D845EBG2 and the D845EPT2.

Intel will also introduce its Gfx motherboards at the same time - these use the 845G chipset and again support DDR memory and USB 2.0. The boxed boards will be called the D845GBV and the D845GRG.

Early in the third quarter of this year, Intel will introduce its 845GL chipset - a cut down, or crippled version of the 845G. These use the 400MHz front side bus. The D845GLAD and the D845GLLY come with DDR support and SDRAM support respectively, and integrated "Gfx" as well as USB 2.0. Both are microATX mobos.

So. The 850EMV2, the D850EMD2, the D845GBV and the D845GRG, as well as the D845BG2 and the D845PT2 all use the 533MHz front side bus, and by the end of Q4, with the exception of those using the 845GL chipset, will displace all other Intel boxed desktop motherboards.

By then we can wave farewell to the 815E and its derivatives forever. µ

See Also
Up to date Intel roadmaps