AMD outlines Next Generation Factory route

AMD MANFACTURING chief, Douglas Grose tells a symposium this morning to rethink its models for the Next Generation Factory (NGF).

In the morning keynote at the 4th International Sematech Manufacturing Initiative (ISMI) Symposium in Texas, Grose, senior vice president of manufacturing, technology development and supply chain at AMD, outlined his " strategic imperatives" for the Next Generation Factory.

Grose told circuit manufacturers, material suppliers, tool vendors and industry analysts that the industry needs a smarter approach to semiconductor development, production and delivery.

He focused on how to get the most out of existing 300mm technologies and facilities before moving onto a 450mm wafer size.

AMD said it is joining with industry partners, including ISMI, to develop new tools and processes for further streamlining both front-end and back-end production.

It advocates Small Lot Manufacturing (SLM) and Single Wafer Tools (SWT) for improving manufacturing efficiency, but says this requires an industry-wide shift in thinking.

AMD says it has saved time and money, in Dresden by putting its NGF scheme on line. It claims a 26 percent reduction in monthly wafer costs, a 31 percent increase in wafer output and a 72 percent increase in productivity.

“We’re already seeing impressive results across AMD, but we’ve only realized a fraction of the full potential of the Next Generation Factory,” Grose reckons. µ

L'INQ
4th International Sematech Manufacturing Initiative Symposium