Intel shows off mobile WIMAX chipset

The firm is to bundle the chip with its multi-band WiMAX/Wi-Fi radio chip to create a chipset it calls the Intel WiMAX Connection 2300.

The chipset design was demonstrated during veep Sean Maloney's keynote at the 3G World Congress and Mobility Marketplace in Hong Kong.

Maloney showed an Intel Centrino Duo laptop with mobile WiMAX (IEEE 802.16e-2005), Wi-Fi (IEEE 802.11n) and high-speed downlink packet access (HSDPA) 3G capabilities accessing the Internet at broadband speeds over a mobile WiMAX network.

Intel says its part of its cunning plan to get everyone well connected.

Maloney said he wanted to eliminate the "seams that prevent ubiquitous wireless connectivity".

The design brings Intel a step closer to its aim of a integrated wireless system-on-chip that it believes will help drive WiMAX adoption.

Intel incorporated multiple input/multiple output (MIMO) functionality into the baseband chip to enhance the signal quality and throughput of wireless bandwidth. The baseband chip also employs the same software for Intel's WiMAX and Wi-Fi solutions to help ensure unified management for connectivity.

The firm said it plans to sample both card and module forms beginning in late 2007. µ