Moorestown demo teams Intel and Ericsson on HSPA
INTEL AND ERICSSON are teaming up to bring High Speed Packet Access (HSPA) to mobile Internet devices (MIDs). Ericsson also announced it would extend its 3G mobile broadband from notebooks to a plethora of other pocket devices.
The move was announced at the Intel Developer Forum in Taiwan by Intel's senior veep and Ultra Mobility Group general manager, Anand Chandrasekher.
Chandrasekher gushed about the progress Chipzilla was making in the MID market and demonstrated the 'Moorestown' platform at work for the first time.
Made up of a System on a Chip (SOC), dubbed 'Lincroft', Moorestown integrates a 45nm processor, graphics, memory controller and video encoder/decoder on a single chip. It also boasts an I/O hub, 'Langwell', to connect I/O ports with wireless, storage and display components as well as a fair few board level functions.
Noting that Moorestown would be a catalyst for pushing the “full Internet experience” into the smartphone space, Chandrasekher said Moorestown platforms would support a whole multitude of wireless technologies including 3G, WiMAX, WiFi, GPS, Bluetooth and even mobile TV.
He added Intel was was well on track for bringing Moorestown’s idle power down by over ten times that of the first-generation MIDs based on the Atom processor.
Discussing the Ericsson partnership, Chandrasekher said HSPA data modules - sized 25×30×2.x mm - had been optimised for the Moorestown platform and was scheduled for release in 2009/10.
In another announcement, Chandrasekher noted that wireless technology company, Option, was also extending its collaboration for HSPA modules to the Moorestown platform with a new 3.5G HSPA embedded module. µ
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Straight from intel Press emailings late last night was essentially facts above, also mentioned are Nahalem group, with expectation that Vpro will be added in 2009. Heres clip of similar clip of original:

highlighted was the progress Intel is making in the Mobile Internet Devices (MID) market segment with the world's first working "Moorestown" platform demonstration.

Moorestown comprises of an SOC, codenamed "Lincroft," which integrates the 45nm processor, graphics, memory controller and video encode/decode onto a single chip and an I/O hub codenamed "Langwell", which supports a range of I/O ports to connect with wireless, storage, and display components in addition to incorporating several board level functions. Chandrasekher stated that Intel is on track to reduce Moorestown platform idle power by more than 10x compared to the first-generation MIDs based on the Intel Atom processor.

Chandrasekher said that Moorestown will be a catalyst for exciting and innovative developments that will extend the full Internet experience into the smartphone space with the Communication MID. He indicated that Moorestown platforms will support a range of wireless technologies including 3G, WiMAX, WiFi, GPS, Bluetooth and mobile TV. Additionally, Chandrasekher announced a collaboration with Ericsson* for HSPA data modules optimized for the Moorestown platform. He also announced that Option* is extending its collaboration for HSPA modules to the Moorestown platform. These 3G modules come in 25x30x2.x mm small size, are optimized for Moorestown power requirements and will help provide MID users with more powerful, always connected Internet-based experiences.

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