A technical presentation to be delivered by Mike Trainor, manager of Intel's mobile platforms, will feature the Mobile Internet PC 2003 features, based on standard and low voltage designs of Banias.
As we have reported, there will be options using the Calexico chipset, for 802.11a/b, but the presentation will predict that battery life for the standard Banias chip will only be between 3.5 and 4.5 hours, with machines typically have 14 to 15 inch screens, a thickness of 1.2 to 1.4 inches, and a weight between 4.5 and 5.5 pounds. Both Windows XP and W2K will be supported.
The LV (low voltage) version will typically be incorporated in machines with 12 to 14.1 inch screens, with thickness of 0.8 to 1.2 inches, and weights of three to four pounds.
Both these Banias chips will use the Odem and Montara GM chipsets.
Intel will say that the Banias microarchitecture is likely to give the best performance within specific heat envelopes, using Micro Ops fusion and ESP folding, and enhanced data buffering. The chips will also support SSE-2.
Odem will support DDR 266 memory, up to 1GB, and ICH4.
Intel claims that Bian has a power optimised logic design with advanced clock gating and a version of SpeedStep known as Enhanced Speedstep. It will have three options, as we've noted before, standard, LV and ultra LV, with the standard voltage being less than 1W average power while the ULV will be less than half a watt. Odem, the chipset, includes dynamic IO buffering.
Intel will say it has initiaves to optimise LCD backlight time, improve its graphics and comms device performance states, and has a new tool to monitor whether devices are well power managed.
It is producing the Banias chips in packages such as micro flip chip pin grid array and micro flip chin ball grid array to give much thinner chips.
Calexico is a mini PCI card format that Intel will offer as kits for manufacturers. Calexico gives dual band wireless ability with low power.
Another presentation says that the notebook in 2004, using the "Dothan" chip, will focus on decreasing display power with potential options being low temperature polysilicon LCD, reflexive TFT LCD, and transflective TFT LCD screens.
Low temperature polysilicon screens are likely to arrive in volume in the first half of 2004, reflective LCD in the second half 2004, along with transflective TFT screens, while other technologies such as OLED and bistable screen are much further down the line - perhaps not being produced in volume until 2006 or beyond.
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