Samsung readies skyscraper memory package

THE SEMI division of Samsung said it has created a 16-chip multichip package for memory.

The 16-chip technology, which uses 8Gbit NAND flash, will let Samsung build a 16GB device.

The firm said the major obstacle it faced was to use thinner silicon wafers and it is now using tech that makes the overall thickness of a wafer 30 microns (µm).

It's also using a laser cutting technology which differs from the conventional hacksaw approach. To put the bits of silicon on top of each other, it uses wire contacts on one side of the wafer slivers only, with the dies stacked in a zigzag.

It's also managed to reduce the thickness of the glue to 20 microns (µm) so the height of a 16 die stack is only 1.44mm. The 101 Tower in Old Taipei is 509,000 millimetres high. µ