SUPERCOMPUTER maker Cray has signed a multi-year deal with Intel to use its silicon in High Performance Computing (HPC) products. Details are sketchy, with a conference call scheduled for later today US time.
The two companies plan to explore future supercomputer component designs such as multi-core processing and advanced interconnects. As a result of the deal, Cray and Intel will develop a range of HPC systems and technologies over the 'next several years'. Xeon processors will be used initially, say the companies.
Cray currently uses AMD silicon in its XT3, XT4 and XT5 ranges. An unnamed Intel source said he believed AMD would still play a part in Cray's future plans, but could not elaborate further. Whatever the outcome, it can only be seen as a significant kick in the teeth for troubled AMD.
Pat Gelsinger reckoned Cray's commitment to Intel a "testament" to "the strength of our hardware and software roadmap and many-core research."
"Together we will enable fundamental and historical problems of science and industry to be solved," he burbled, according to a premature Intel emission.
More details later, we hope. µ
Sign up for INQbot – a weekly roundup of the best from the INQ