This new device is ideal for supplying mobile processors with core and I/O voltages, Sipex says. The SP6265 reduces height by offering a 0.6mm ultra-low profile package enabling designers to meet critical height requirements for ultra-slim consumer devices like phones.
The company claims the lower profile allows for board space reduction, package efficiency in the z-dimension, and overall system weight reduction.
The integrated dual-channel design also reduces the component count by removing the need for two separate devices. Additionally, the SP6265 is available in fixed output options from 1.8V to 3.3V thereby eliminating the need for an external resistor network.
Pricing for the SP6265 in a DFN-8 package is $0.75 or $0.70 for a TSOT-23-6 package in quantities of 1,000 units. ยต
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Sipex