IBM stacks chips for cellphone products

BIG BLUE said that it has designed a 3D chip which will give it the edge in power consumption and size.

The idea isn't absolutely new - the memory guys are already doing some of this stuff, but the way IBM's doing it appears to be somewhat novel.

According to the Wall Street Journal, IBM makes little holes in semiconductors and then uses an injection of tungsten to connect the different layers together.

The report adds that both Intel and AMD are working on 3D microprocessors which could appear as soon as 2009. µ

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