ASML updates immersion tools

ASML UPDATED ONE of the more critical tools used to make semiconductors, the Twinscan XT: 1900i was replaced by the 1950i. This may not mean that much to you, but if you want to make next gen semiconductors, this technology is necessary.

It is a water immersion based lithography tool, basically it draws pretty patterns on wafers under water. This allows engineers to image things at less than 38nm whereas the older 1900i could only do 40nm. For those without silicon in their veins, this is about what you need to do a half process step, something the memory folk would and do kill for.

Big, expensive and wet

With a 1950i, you should be able to make notably smaller memory, and do it faster than the older 1900i. The new part is rated at 148 wafers per hour, so you not only get more throughput, you get higher density per wafer, what's not to love.

There are already a ton of these in place, but the official launch is in Q1/09. Between them, the 1900i and 1950i have processed over 20 million wafers. If you don't think immersion is doable, these productions numbers show that someone is making a good show of it.

The other part that ASML was not showing off but talking about is the EUV technology. ASML is a firm believer in it, and just demonstrated the first 32nm SRAM made with EUV tools. They are taking orders for it now, and expect to be delivering units in 2010. Others may be skeptical, but tool delivery seems to be a pretty solid statement.

In general, ASML's showing at Semicon said that the next gen of tools is ready to service the next gen process, and possibly the one after that. Immersion seems quite doable, and EUV is looking more promising. Things won't be cheap, but the future is looking brighter. µ