UMC seeks financial damages from SIS

That follows a ruling earlier this month when US government body the International Trade Commission (ITC) made a ruling that SIS made semiconductors that breached UMC's porcess.

SIS claimed at the time that it would continue shipping products until a final decision was made 60 days down the line, but Taiwanese newspaper Economic News quotes the UMC CEO, John Hsuan, as describing that claim as invalid.

The paper further quotes Hsuan as saying that chipsets, mobos and graphics chips can only enter US territory after a large bond is placed against the imported goods.

The amount being claimed against SIS was not revealed.

SIS maintains that it has now amended its process technology and will start shipping products that do not breach the ITC ruling in November. µ

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UMC claims victory in patent scrap with SIS