UMC uses 45nm technology for SRAM

According to Forbes, the chips were made using sophisticated immersion lithography for its 12 critical layers.

Immersion lithography sticks a liquid between the scanner optics and the wafer surface, replacing the traditional air gap. This manages to improve the optical resolution because the immersion fluid, has a higher refractive index than air.

UMC said that the development will build on its 45-nm momentum to improve yields and prepare the technology for adoption by foundry punters.

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