Submerging silicon in water makes for faster chips

THERE'S AN intriguing report of a technique developed by the Rochester Institute of Technology (RIT) that could overcome current and future problems in shrinking chip dies.

According to local newspaper The Democrat & Chronicle, RIT is showing off its discovery to chip giants Intel, IBM, Motorola and other semiconductor firms.

The method would mean placing a silicon wafer in water and using its refractive properties to design much smaller lines than are currently possible.

The RIT team have prototypes allowing them to make semi circuits a tenth of the size that current technology allows.

There's more on this breakthrough, here. µ