It said it began volume production on 90nm during the third quarter of this year, but now claims to be the only foundry to combine that with 12-inch wafer production, copper interconnect and low-k dielectrics.
The firm said it has started producing "several thousand" 12-inch wafers during 2004, and this number will increase next year.
It said 40 single product mask sets will tape out before the end of this year, and 30 more will tape out before the end of the year.
TSMC produces chips for customers such as Altera, Qualcomm, Nvidia, Via and ATI to their designs. Its Nexsys 90 process offers, it said, two times gate density improvement, 35 per cent faster speed, a 60 per cent increase in active power savings and a 20 per cent interconnect RC improvement over its .13µ (micron) process.
The firm faces competition from UMC, from SMIC, from IBM Microelectronics, and from Chartered and like all these foundries anticipates something of a slowdown of orders in 2005. µ
Sign up for INQbot – a weekly roundup of the best from the INQ