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AMD etching for a fight

Gearing up for 300mm transition
Wed Sep 11 2002, 18:28
AMD HAS PLACED placed an order for hardware to help transition from 200 to 300mm technology, Lam Research Corporation reveals.

Lam Research says it will supply its 2300 Etch Series to the chipmaker "to develop next-generation logic and flash processes".

The company says its 2300 Exelan dielectric and 2300 Versys silicon etch systems is installed at AMD's Submicron Development Center (SDC), which supplies next-generation technology to all AMD fabs worldwide.

It says the hardware will be used in both front- and back-end etch applications for AMD's development efforts.

In a statement, AMD director of Advanced Process Development Dr. Linton Salmon, said, "The transition to 300-mm technology helps us offer even greater benefit to our customers," for "During the transition, we need to move easily between 200- and 300-mm wafer sizes. We expect that the 2300 Etch Series equipment will enable developing 200-mm processes cost effectively followed by straightforward scaling to 300 mm."

Lam Research Corporation is to be found here . ยต

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