The 12-inch fab, based in Mie Prefecture, Japan, will use 56 nanometre technology with plans to move to 43 nanometre tech, said Toshiba.
The building, dubbed Fab 4, uses earthquake dampening features which can cut tremors by two thirds. The building is funded by Toshiba and a Toshiba-Sandisk joint venture called Flash Alliance.
The firms said that the fab will be able to churn out 210,000 wafers a month if necessary. µ