Samsung eight-die multi-chip released

SARF KOREAN purveyor of chippy bits, Samsung says that it has developed the world's first eight-die multi-chip (MCP) package technology for use in high capacity mobile devices.

The new MCP chip has a combined capacity of 3.2 gigabits and is only 1.4mm thick. This apparently means that there could be yet another new generation of cell phones and mobile devices offering more services and faster Internet surfing.

In a press release, the company said that the new eight-chip MCP is an extremely compact, high-capacity solution that is likely to trigger development of new next-generation mobile applications. "It will provide much greater functionality in cellphones and other smart mobile devices, from movie videos to games as well as faster Internet access," a SpokesSam sung.