AMD bumps lead from its solder

The chip maker says it has agreed to license lead free electroplated wafer bumping technology from specialist, Amkor Technology.

David Bennett, vice president of strategic manufacturing and alliances at AMD claimed the firm demonstrated, "environmental responsibility and customer-centric thinking" in how it produces its products.

"Amkor's technology," he burbled, would come in handy, "as we drive towards a lead-free solution for AMD products."

The electroplating technology makes use of Tin-Silver (SnAg) alloy to produce the solder bumps on fabricated semiconductor wafers.

Chip makers have been loathe to give up high-lead alloy formulations in favour of safer, but more expensive, Tin-Silver for electroplating bumps onto semiconductor wafers.

But as environmental cataclysm looms, even chip makers like to be seen to be green. µ