Apple's patent is like the kid at school sharking off the kid at the next desk - Samsung, in this case - in an exam.

Agree with NVFANHATER, I can't see how Apple can get their patent approved as there is so much prior art - I really don't think Samsung has anything to worry about.

Not sure if anyone actually has a patent for POP (hope not, how ridiculous) but TI with their OMAP ARM SoCs (if not predecessors) have supported package-on-package since inception and this pre-dates iPhone, and POP is a manufacturing method used in many Nokia devices.

You might want to check first. Apple is not the one invented the 3D stacking chip.

IBM does (well it's zurich labs does).

http://www-03.ibm.com/press/us/en/pressrelease/24385.wss

So, i don't think apple patent application would be approve by USPTO.