"I sold graphite to cool blast furnaces in the 80's and it was old technology then."

So what, many good/great ideas is about applying something that works in one area to another area.

If you personally had made computer heatsinks and sold in the 1980's then it would have been a different story. ^^

and it was waaay more thermally conductive than normal heat-sink compound, according to the #s...

They probably still do...

2002 research. 2005 article. How is any of this NEWS again?

I sold graphite to cool blast furnaces in the 80's and it was old technology then.

If you follow the link in the linked page you will find the original Power Electronics Technology article which explains this is a new graphite/epoxy material.

Looks promising especially as its a molding process. I would want to know if there might be an issue though with the material's strength. Will it form fine vanes without becoming fragile or is it restricted to chunky forms like low profile passive heatsinks, can you get enough surface area per volume to use as a CPU heatsink?

QUOTE

"In 2002, a new natural graphite-epoxy composite material was developed. The material is lightweight, being only 1.9 g/cm3, and has an in-plane thermal conductivity of 370 W/mK, which is close to that of copper. This material is being used today as a fin material in combination with an aluminum or copper base to make hybrid heatsinks. As a fin material, the graphite-epoxy composite offers thermal performance significantly better than aluminum and approaching copper, but at only 70% and 21% of the weight of aluminum and copper, respectively. The result is a heatsink that performs like copper but at a fraction of the weight. These natural graphite-based heatsinks have been used trouble-free in production power electronics applications since August 2003."

/QUOTE

it should be 2oz copper PCB.

I guess I must have a monster in my computer... it seems to be a bit heavier than 2oz. Either that or I am far weaker than I think I am.

Perhaps a typo?