I think this guy's just trying to sound cool. Get a life, dude.

If fact thermal budget refers to the total amount of heat (ºC*processing time at each fabrication step). Thermal budget must be kept as low as posible to avoid dopant diffusion, ...

(Current) Leakage is related to the device/circuit when biased, nothing to do with processing but with geometry/topology at the device level.

Either Drashek's a bot and his software has been majorly improved, or a translation program somewhere has itself been majorly improved.

Sorry, you have serious problems if you are making sense of all Drashek's writings....

Drashek always makes sense - you just have to read better.

Drashek just made sense!

Well apart from the fruit basket.

Charlie writted article yesterday from SF Developers forum, where 12 nm was displayed. here:

http://www.semiaccurate.com/2009/07/15/imprint-lithography-stamps-out-chips/

It uses laser & use 1 sec cool down as device etchs or prints image onto glass substrate & Resist, then washes away unlasered area. Its Fruit Basket World.

vondrashek